Events and Activities

The installation of ICP etcher for compound semiconductor and Plasma Enhanced Chemical Vapor Deposition (PECVD) system were completed in 2022. A webinar was arranged with Oxford Instruments Plasma Technology on October 12^th, 2022, and over 50 NFF(CWB) users attended the event.

Dr. Ligang DENG, principal applications engineer of Oxford Instruments Plasma Technology, gave a presentation about III-V process overview and troubleshooting.

Dr. Young HUANG, technology & business development manager of Oxford Instruments Plasma Technology Asia, gave a presentation about conventional ICP vs Atom Layer Etch (ALE) for GaN process. The presentation material has been posted on NFF(CWB) website for NFF(CWB) users’ reference.