TEOS PECVD
With the support of equipment fund from VPRDO and matching funds from various HKUST academic departments, NFF (CWB) purchased a TEOS PECVD from Oxford Instruments. This new equipment uses silane and Tetraethyl orthosilicate (TEOS) as a silicon source, which can deposit silicon dioxide and silicon nitride with dual frequency (13.56 MHz and 200 kHz) for stress control of thin film induced onto the substrate. The installation of the equipment has been delayed due to the COVID-19 pandemic, and the target completion date of installation is January 2022.
ICP Etcher for Compound Semiconductor
NFF (CWB) successfully obtained equipment funding from UGC using the Joint Laboratory Funding Scheme (JLFS). NFF (CWB) has been collaborating with IMECAS on a joint laboratory on microelectronics since 1996.
NFF (CWB) used the funding to purchase an ICP etcher from Oxford Instruments to support compound semiconductor etching processes, which can enhance photonics, optoelectronics and power device research. The installation is currently delayed due to the COVID-19 pandemic, and the target completion date of installation is January 2022.
Re-engineering of Two Varian 3180 Sputtering Systems
In 2020, the re-engineering of two Varian 3180 sputtering systems was completed, and the equipment was released for service. The re-engineering works will extend the lifetime of these sputtering systems by at least 10 years, save a lot of maintenance effort, and alleviate user demand for the sputtering process.
Many thanks to facility manager, Mr. Preason LEE, for leading the technical team and to VPRDO for providing financial support for this project.
