CRF 2020/21 Collaborative Research Equipment Grant (CREG) Proposal
 

Under the leadership of Prof. Andrew POON, NFF (CWB) successfully obtained equipment funding for a high-accuracy wafer polisher and bonders for heterogeneous integration (C6002-20EF). The total funding is HK$12.5 million (50% from UGC and 50% matching from HKUST), and the project duration is from June 2021 to May 2024.

Three pieces of major equipment will be purchased in 2021/22:

  1. A wafer polisher for surface treatment.
  2. A wafer bonder, which performs a wide-range of wafer-to-wafer bonding processes and supports substrates with a wafer size of up to 200 mm. The high bonding force (100 kN), a maximum bonding temperature (550 oC), and a chamber pressure that can be down to 5x10-5 mbar make the system perfect for use in research and development, for applications from MEMS, advanced packaging, three-dimensional (3-D) integration, and light-emitting-diode (LED) fields.
  3. A semi-automatic flip-chip bonder that guarantees 0.5 µm post-bonding accuracy and high-bonding-force (up to 1000 N) chip-to-chip and multiple-chip-to-wafer bonding.  The size of the chips to be bonded can be as large as 100 mm × 100 mm. which makes it suitable for universities and R&D institutes.
suss wafer bonder XB8
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