A new wafer bonder was installed and became operational in NFF(CWB) Phase 2 lab in April 2023. It provides additional process capability on adhesive, eutectic, anodic substrate bonding and silicon fusion pre-bonding.
A new flip chip bonder was released to NFF(CWB) users for operation in May 2023. It provides flip chip and die bonding services. The bonding accuracy can be down to +/- 0.5 um.
A new oxidation furnace for SiC has also been released to NFF(CWB) users this year. From now on, with this high temperature OXIDATOR, NFF(CWB) users can grow high quality oxide layer on SiC substrate. In addition, the Post Oxidation Annealing process in NO and N2O atmosphere is also available.
Another newly modified NFF CY Sputterer has been installed and released for operation in NFF(CWB) Phase 2 lab in May 2023. This magnetron sputtering system is equipped with two DC and one RF power supply, which fulfills the increasing need of NFF(CWB) users on Semi-Clean metal/dielectric/ ferromagnetic thin film deposition process. The system has strong pumping capability: it can achieve high vacuum of 2x10-6 Torr within half an hour. This greatly shortens the required pump-down time.